Surface pre-treatment
For a flawless adhesive bond, surfaces must be clean And dry

Application
Weicon Repair Sticks can bridge a bonding gap of max. 15 mm per work step. The specified pot life refers to a material preparation of 25g at room temperature. Larger preparation quantities result in a faster curing time due to the typical reaction heat of epoxy resins (exothermic reaction). Higher temperatures also reduce the pot life and curing time. (General rule: every increase by +10°C above room temperature results in a decrease of the pot life and curing time by half). Temperatures below +16°C increase the pot life and curing time significantly. From approx. +5C and below, no reaction takes place. 

Storage
When unopened, Weicon Repair Sticks can be stored at a constant room temperature of approx. +20°C in a dry place for at least 18 months. Protect from direct sunlight.